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THERMAL MANAGEMENT SOLUTIONS

Liquid Cold Plates &
Thermal Solutions

Configure advanced cooling solutions engineered for high-power electronics, power modules, batteries and AI infrastructure.

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High Heat
Flux
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Liquid
Cooling
⌁
Custom
Channels
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Thermal
Engineering
DESIGN YOUR SOLUTION

Configure Your Thermal Solution

Configure your heat load, coolant and mechanical requirements.

STEP 01

Heat Load Requirements

Define the thermal load and temperature targets for your application.

Thermal Priorities

Select the performance characteristics most important to the design.

STEP 02

Cooling Requirements

Define the coolant, flow conditions and hydraulic requirements.

Cooling Features

STEP 03

Mechanical Requirements

Define material, envelope, interfaces and production requirements.

Mechanical Features

STEP 04

Review Your Configuration

Review your thermal requirements before continuing to RFQ.

THERMAL TECHNOLOGIES

Advanced Cooling for High-Power Electronics

Thermal management technologies engineered for increasing power density, heat flux and system-level cooling requirements.

LCP

Liquid Cold Plates

Custom liquid-cooled plates for high-power electronics and energy systems.

LIQUID COOLING
MIC

Microchannel Cooling

Fine-channel cooling for high heat flux and compact interfaces.

HIGH HEAT FLUX
VB

Vacuum-Brazed Cold Plates

Brazed internal channels for efficient, robust liquid cooling.

HIGH PERFORMANCE
FSW

Friction-Stir-Welded Plates

Welded aluminum plates for demanding pressure and reliability requirements.

ROBUST CONSTRUCTION
Cu

Copper Cooling Solutions

Copper structures for low spreading resistance and concentrated cooling.

HIGH CONDUCTIVITY
CUS

Custom Thermal Assemblies

Integrated cold plates, manifolds, fittings and thermal interfaces.

CUSTOM ENGINEERING
ENGINEERING & MANUFACTURING

From Heat Load to Cooling Solution

Engineering support across thermal, fluid, mechanical and manufacturing requirements.

01

Thermal Design

Cooling architecture and heat-transfer optimization based on heat load, temperatures and system constraints.

02

Flow Optimization

Channel and manifold design targeting heat transfer, flow distribution and pressure-drop requirements.

03

Mechanical Integration

Custom interfaces, mounting, fittings and packaging for integration into the complete power system.

04

Testing & Validation

Pressure, leak and thermal performance requirements can be incorporated into the production plan.

MARKETS

Cooling Power-Dense Systems

AI

AI & Data Center

Liquid cooling for accelerators, power shelves and high-density compute infrastructure.

EV

EV & Charging

Thermal management for inverters, onboard chargers and high-power charging systems.

ESS

Battery & Energy Storage

Cooling solutions for battery modules, packs, converters and storage systems.

SiC

SiC & GaN Power

High-performance cooling for high-power-density semiconductor modules and converters.

A&D

Aerospace & Defense

Compact thermal solutions for demanding size, weight and reliability requirements.

IND

Industrial Power

Cooling for drives, robotics, power supplies and industrial conversion systems.

FREQUENTLY ASKED QUESTIONS

Thermal Solutions FAQs

The most useful starting information includes total heat load, heat-source locations, allowable temperatures, coolant type, inlet temperature, available flow rate, pressure-drop limit and mechanical envelope.
Yes. You can select Engineering Recommendation in the configurator when the construction method or flow architecture has not yet been determined.
Both methods can create sealed internal flow structures, but the preferred process depends on channel geometry, material, pressure, size, production volume and reliability requirements.
Yes. Designs can be evaluated for multiple devices with uniform or non-uniform heat loads, including custom flow distribution around concentrated heat sources.
Copper, aluminum and hybrid constructions can be considered depending on thermal performance, weight, corrosion, manufacturability and system requirements.
Yes. Upload your mechanical drawing or 3D CAD model together with available thermal and coolant requirements for engineering review.
START YOUR PROJECT

Configure your thermal solution.

Define your cooling requirements or work with a Silentra engineer.

Talk to an Engineer