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CERAMIC SUBSTRATE SOLUTIONS

DBC & AMB
Ceramic Substrates

Configure high-performance ceramic substrates for power electronics, thermal management and high-reliability applications.

◇
DBC / AMB /
DBA
▱
AlN / Al₂O₃ /
Si₃N₄
ϟ
High-Current
Metallization
◎
Precision
Patterning
DESIGN YOUR SOLUTION

Configure Your Ceramic Substrate

Define your substrate, metallization, electrical and mechanical requirements. Silentra engineering will review the configuration before final quotation.

STEP 01

Substrate Construction

Select the ceramic technology and base material for your application.

Operating Conditions

Optional, but these values help our engineering team evaluate the substrate construction.

STEP 02

Metallization

Define copper construction, plating and surface finish requirements.

Assembly Interface

Tell us how semiconductor devices will interface with the substrate.

STEP 03

Pattern & Geometry

Define circuit patterning, feature size and mechanical requirements.

Special Features

STEP 04

Upload Design Files

Upload whatever design documentation is currently available. Additional files can be supplied later.

STEP 05

Review Your Configuration

Review the substrate requirements before continuing to the RFQ.

CERAMIC SUBSTRATE TECHNOLOGIES

Advanced Substrates for Power Electronics

Ceramic substrate technologies engineered for thermal performance, electrical isolation and power cycling reliability.

DBC

DBC

Direct Bonded Copper substrates combining thick copper conductors with electrically insulating ceramic.

POWER & THERMAL
AMB

AMB

Active Metal Brazed substrates designed for demanding thermal cycling and high-reliability power modules.

HIGH RELIABILITY
DBA

DBA

Direct Bonded Aluminum solutions for applications where weight, thermal performance and cost are important.

LIGHTWEIGHT
AlN

Aluminum Nitride

High thermal conductivity ceramic for power-dense semiconductor and advanced module applications.

HIGH THERMAL CONDUCTIVITY
Al₂O₃

Alumina

Proven ceramic substrate material offering electrical isolation, manufacturability and cost efficiency.

VERSATILE & COST EFFECTIVE
Si₃N₄

Silicon Nitride

High mechanical strength and thermal cycling capability for automotive and high-reliability power modules.

POWER CYCLING
ENGINEERING & MANUFACTURING

From Substrate Design to Production

01

Material Selection

Engineering support for ceramic material, thickness and substrate technology selection.

02

Circuit Patterning

Precision copper patterning for high-current and power semiconductor applications.

03

Surface Finishing

Metallization and finishing options compatible with die attach, sintering and wire bonding.

04

Engineering Review

Thermal, electrical, mechanical and manufacturability review before production.

MARKETS

Built for High-Power Applications

EV

Electric Vehicles

Traction inverters, onboard chargers and high-power DC/DC.

AI

AI & Data Center

High-density power conversion and advanced power delivery.

ESS

Energy Storage

High-power converters, inverters and battery systems.

IND

Industrial Power

Motor drives, robotics, automation and power conversion.

UAS

Aerospace & UAS

Power-dense electronics where size, weight and reliability matter.

GRID

Energy Infrastructure

High-voltage power conversion and grid-connected electronics.

FREQUENTLY ASKED QUESTIONS

DBC & AMB Substrate FAQs

DBC directly bonds copper to ceramic, while AMB uses an active-metal brazing process. The preferred technology depends on ceramic material, thermal cycling, mechanical reliability and application requirements.
Alumina, aluminum nitride and silicon nitride provide different combinations of thermal conductivity, mechanical strength, electrical isolation, cost and power-cycling performance. Silentra can help evaluate the appropriate material.
Yes. Copper thickness can be configured based on the substrate technology, current requirement, thermal performance and manufacturing constraints.
Yes. Patterned substrates and multiple surface-finishing options can be specified for soldering, sintering, wire bonding and other assembly processes.
Yes. Engineering review can address ceramic selection, copper thickness, geometry, isolation, thermal performance, manufacturability and assembly-interface requirements.
Projects can range from engineering and prototype builds through recurring production, depending on the substrate technology and specifications.
START YOUR PROJECT

Configure your ceramic substrate.

Define your requirements or talk with a Silentra engineer.

Talk to an Engineer