POWERING
WHAT’S NEXT
Silentra engineers advanced power and thermal technologies from device to system — integrating power semiconductors, magnetics, advanced substrates, thermal management and intelligent power systems.
Supported by U.S. and Asia-Pacific manufacturing capabilities from prototype through production.
FOUR TECHNOLOGIES. ONE SYSTEM.
As power density increases, semiconductor efficiency, power conversion, interconnect and thermal performance become increasingly interconnected.
POWER SEMICONDUCTORS
SiC • GaN • MOSFET
Higher efficiency and power density
POWER MAGNETICS
Transformers • Inductors
Planar Magnetics
ADVANCED SUBSTRATES
& INTERCONNECTS
MCPCB • Heavy Copper • Busbars
DBC • AMB
THERMAL MANAGEMENT
Cold Plates • Liquid Cooling
Thermal Interfaces
FROM DEVICE TO SYSTEM
Integrating critical technologies into application-specific power architectures.
DEVICE
Power Semiconductors
CONVERSION
Magnetics
INTERCONNECT
Substrates & Busbars
THERMAL
Thermal Management
INTELLIGENT SYSTEM
Battery, BMS, PDU
Power Modules
FROM REQUIREMENT TO PRODUCTION
A structured engineering process that connects system requirements, electrical and thermal design, validation and manufacturing.
From initial requirements through production, Silentra connects electrical, thermal, mechanical and manufacturing considerations throughout the development process.
U.S. + APAC MANUFACTURING
Silentra combines domestic manufacturing with specialized Asia-Pacific capabilities to support programs from prototype through scalable production.
🇺🇸 U.S. MANUFACTURING
Rapid Development • NPI • Domestic Production
- PCB Fabrication
- PCB Assembly
- Advanced SMT
- Prototype & NPI
- Testing & Inspection
- System Integration
ASIA-PACIFIC MANUFACTURING
Specialized Technologies • Advanced Materials • Scale
- MCPCB & Heavy Copper
- DBC & AMB
- Ceramic PCB
- Busbars & Interconnects
- Power Magnetics
- Thermal Solutions
ENGINEERED FOR HIGH-PERFORMANCE SYSTEMS
LET’S ENGINEER WHAT’S NEXT — TOGETHER.
From advanced components to integrated power systems.