POWER ARCHITECTURE FOR
AI INFRASTRUCTURE
High-density power conversion, delivery and thermal technologies engineered from the rack to the accelerator.
AI COMPUTE IS BECOMING A POWER & THERMAL CHALLENGE
HIGHER CURRENT
Delivering increasingly large currents close to the processor.
HIGHER POWER DENSITY
More power in less board and rack space.
MORE HEAT
Removing heat without compromising efficiency or reliability.
ENGINEERING THE AI POWER PATH
We engineer every stage of the power path to deliver maximum efficiency, power density and reliability for AI infrastructure.
400V / 800V DC
IBC / DC-DC
CONVERSION
50V
DISTRIBUTION
HIGH-CURRENT
PCB & BUSBAR
POINT-OF-LOAD
POWER
AI
ACCELERATOR
TECHNOLOGIES FOR HIGH-DENSITY AI POWER
- 400V → 50V IBC
- 800V → 50V IBC
- High-Efficiency DC/DC
- Solid-State Protection
- Heavy Copper PCB
- Embedded Copper
- Laminated Busbars
- High-Current Interconnect
- SiC / GaN Modules
- Planar Transformers
- Planar Inductors
- Integrated Magnetics
- Liquid Cold Plates
- TIM
- Heat Spreaders
- Graphite / Vapor Chambers
OPTIMIZE THE SYSTEM,
NOT JUST THE COMPONENT
Our integrated approach delivers measurable improvements across the entire system.
ELECTRICAL
Lower conduction and switching losses.
THERMAL
Shorter thermal paths and higher heat extraction.
MECHANICAL
Higher power density and reduced system volume.
MANUFACTURING
Designed for scalable production.
FROM REQUIREMENT
TO PRODUCTION
DEFINE
Voltage, current, power density, thermal and mechanical requirements.
ENGINEER
Power architecture, substrates, interconnect, magnetics and cooling.
PROTOTYPE
Rapid engineering builds and validation.
SCALE
DFM, sourcing and production.
BUILD YOUR NEXT HIGH-POWER PLATFORM
Talk with Silentra about your power delivery, thermal or packaging challenge.