Advanced SiC &
GaN Power Modules
Configure custom power modules engineered for high efficiency, high power density, fast switching and demanding thermal environments.
Devices
Density
Packaging
Engineering
Configure Your Power Module
Define your electrical, semiconductor, packaging and thermal requirements. Silentra engineering will review the design for device selection, switching performance, thermal management, packaging and manufacturability.
Electrical Requirements
Define the converter application, voltage, current, switching frequency and electrical performance targets.
Electrical Priorities
Select the key performance requirements for the module.
Semiconductor Devices
Select the preferred semiconductor technology and device architecture, or leave the selection open for engineering review.
Device & Driver Features
Power Module Packaging
Define the module architecture, substrate, interconnect and packaging technologies.
Advanced Packaging Features
Thermal & Mechanical Requirements
Define cooling, temperature, module envelope and production requirements.
Design Files
Upload available electrical specifications, schematics, mechanical drawings, CAD or thermal information.
Review Your Configuration
Review your power module requirements before continuing to RFQ.
Advanced Packaging for Next-Generation Power Electronics
Semiconductor, substrate, interconnect and thermal technologies engineered together for higher efficiency and power density.
SiC Power Modules
High-voltage power modules using silicon carbide devices for efficient high-power conversion.
HIGH VOLTAGEGaN Power Modules
High-frequency gallium nitride architectures optimized for compact, high-density power conversion.
HIGH FREQUENCYAdvanced Ceramic Substrates
DBC and AMB substrates using AlN, Al₂O₃ and Si₃N₄ for electrical isolation and thermal performance.
THERMAL PERFORMANCESintered Die Attach
Silver and copper sintering technologies for improved thermal performance and high-temperature reliability.
HIGH RELIABILITYDouble-Sided Cooling
Advanced module architectures that remove heat from both sides of the semiconductor device.
HIGH POWER DENSITYEmbedded Die
Low-inductance embedded semiconductor architectures for compact next-generation power modules.
LOW INDUCTANCEFrom Semiconductor to Complete Power Module
Integrated engineering across devices, packaging, substrates, interconnects and thermal management.
Device Selection
SiC, GaN and silicon device evaluation based on voltage, current, switching frequency and loss requirements.
Module Packaging
Ceramic substrates, die attach, interconnect and low-inductance packaging architectures.
Thermal Engineering
Thermal stack-up, baseplate, cold plate and double-sided cooling optimization.
Engineering Review
Electrical, thermal, mechanical and manufacturability review before prototype and production.
Power Modules for High-Performance Systems
AI & Data Center
High-frequency, high-density power conversion for next-generation compute infrastructure.
Electric Vehicles
SiC and GaN modules for traction, charging and high-voltage DC/DC conversion.
Energy Storage
Bidirectional power modules for battery energy storage and grid-connected systems.
Drone & Aerospace
Lightweight, compact power modules for electrified aircraft and autonomous systems.
Industrial Power
High-efficiency modules for motor drives, industrial converters and automation.
Energy Infrastructure
High-voltage power conversion for renewable, grid and solid-state power systems.
Power Module FAQs
Configure your power module.
Define your requirements or work with a Silentra engineer.